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¬Article by Hariadi with 0 comments
5 Sep 2008HP & AMD scholarship is non-bonded scholarship where application submission duration is from 11 August 2008 to 30 September 2008.
Successful recipients will each receive a scholarship package worth RM25,000 and disbursed on a lump sump basis and shall be paid directly to the recipients.
How to apply: HP & AMD website
